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Nowadays, there are so many products of 3m™ scotch-weld™ epoxy potting compound dp270 in the market and you are wondering to choose a best one. You have searched for 3m™ scotch-weld™ epoxy potting compound dp270 in many merchants, compared about products prices & reviews before deciding to buy them.
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Here are some of best sellings 3m™ scotch-weld™ epoxy potting compound dp270 which we would like to recommend with high customer review ratings to guide you on quality & popularity of each items.
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MAX EPC A/B – Electronic Potting Compound for Embedding Electronic Printed Circuit Boards ● Encasing Electrical Circuitry● Waterproofing & Insulating ● High Thermal Conductivity 40 Fl.OZ
- Epoxy Potting Compound, Thermally Conductive For Fast Heat Dissipation
- Large Mass, Thick Cross-Section, Low Exothermic Heat Generation
- Lower Viscosity Compared To Other Thermally Conductive Potting Compound
- Insulates AC/DC Current, Suitable For High And Low Voltage Insulating
- Long Working Time – Cures In 24 Hours @ 25°C- Heat Curable For Faster Processing
MAX EPC A/B is room temperature cured epoxy-based electronic potting compound designed for large mass potting or encapsulation of printed circuit boards & circuits. It produces low exothermic heat when cured in a large mass or thick cross-sections. Upon cure, it is electrically non-conductive and provides a permanent barrier against air, corrosive environments, moisture and direct contact with the circuitry.
Its cured performance provides high thermal conductivity for fast dissipation of heat away from the circuitry. It demonstrates low shrinkage and excellent dimensional stability.
MAX EPC A/B bonds to metals, FRP, ABS, PVC, Plastisol, & other plastic compounds used in wire jacketing and electrical enclosures.
MAX EPC A/B is mixed 4:1 by weight; it provides a 90-minute working time for volumes of 3 cubic inches & up to 45 minutes for larger mass -6 cubic inches. Its mixed viscosity is 3100 cPs at 25°C, similar to the consistency of syrup or honey. It is poured into place, self-leveling and designed to release air bubbles and cure void-free.
Upon cure, MAX EPC permanently encapsulates any PCB circuitry in an electrically non-conductive resin matrix that seals it permanently. It is waterproof & is suitable for continuous water immersion.
MAX EPC is opaque black that offers permanent masking of proprietary circuits & components. MAX EPC is tough and impact resistant that demonstrates high compressive strength, and resistant to acids, bases, and solvents.
MIX RATIO : 4:1 By Weight
WORKING TIME: 90 Minutes @ 25°C
CURE TIME: 48 Hrs @ 25°C
ACCELERATED CURE: 2Hrs @100°C
HARDNESS: 85 Shore D
VOLUME RESISTIVITY: 1 x 10 exp16 Ω/CM
DIELECTRIC STRENGTH: 500V/mil
THERMAL CONDUCTIVITY:0.72 W/(m•K)
SERVICE TEMPERATURE: -20°C to 100°C
View Application Video
https://youtu.be/I-GJtGdgUTM
BONDiT B-45 Potting Compound, Coating, 1.7 oz. Kit
- Ideal as a coating, electrical encapsulate or potting compound that bonds to dissimilar materials.
- Bonds a wide range of surface types: polymers, plastics, metals, ceramic & glass.
- Flexible two-part epoxy (75-80 Shore A hardnesss), 2:1 ratio, 130% elasticity.
- Thermal stability of -50°F to +300°F.
- Suitable for harsh environments
BONDiT B-45 is a flexible two-part, 2:1 ratio epoxy with 130% elasticity. It handles harsh environments by being resistant against moisture, salt water, most acids, alkalies, oils, gasoline and detergents. The flexible properties of B-45 allow it to bond a wide variety of materials with different rates of thermal expansion even during extreme temperature changes. The cured product can absorb vibration, shock and impact forces without cracking. Because of B-45’s flexibility and bond-strength, it is often used as a replacement for urethanes in electrical potting applications. Shelf Life: 12 months. Storage: store in a cool, dry place at ambient temperature range, avoid prolonged UV exposure. NEED HELP REGARDING THIS PRODUCT? Contact RELTEK directly for Tech Support, application instructions, storage information, tips & tricks, surface prep information and more. 707-284-8808. This item is Hazardous, and is not eligible for returns. Terms of Sale: This product is manufactured by RELTEK LLC, and is not for repackaging. For distributor arrangements, please contact RELTEK for a distributor agreement.
MAX ELECTRONIC GRADE Epoxy Resin System – 48 Ounce Kit For Electrical Insulation, Electronic Potting, Encapsulating, Waterproffing, Masking Sealant, Circuit Board, Induction Coil
MG Chemicals 9510 One-Part Epoxy Potting Compound, 300mL Cartridge
- Up to 12 months shelf life at room temperature. Frozen storage will extend the shelf life.
- Minimum cure temperature of 80 °C [176 °F]
- Ready to dispense—no mixing is required
- Broad service temperature -65 to 150 °C [-85 to 302 °F]
- Extremely high tensile and compressive strength
9510 is a black, rigid, one-part epoxy potting compound. It has unlimited working time at room temperature and does not require frozen storage. It provides excellent electrical insulation and protects against static discharges, vibration, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals. 9510 has a low viscosity and cane readily used in manual, pneumatic and robotic dispensing processes. Application Instructions: For best results, follow the procedure below. This product does not require mixing prior tousle, and can be applied with a spatula, trowel, or automated dispensing machine. Cartridge: 1. Twist and remove the cap from the cartridge. Do not discard the cap. 2. Dispense the epoxy evenly to both surfaces. 3. To stop the flow, pull back on the plunger. 4. Clean nozzle to prevent contamination and material buildup. 5. Replace the cap on the cartridge. Cure Instructions Room temperature cure: Do NOT cure at room temperature. This product will only cure at elevated temperatures. Heat cure: Put in oven at 80 °C [176 °F] for 3 h. —OR— Put in oven at 90 °C [194 °F] for 1 h. —OR— Put in oven at 120 °C [248 °F] for 30 min.
MG Chemicals Thermally Conductive Black Epoxy Encapsulating and Potting Compound
Thermally conductive epoxy encapsulating and potting compound. 100 Percent solids. Formulated with undiluted Bis F resin for superior physical properties, and pigmented with high purity aluminum oxide pigment to provide excellent thermal conductivity at reasonable cost. Pigmented black for excellent thermal absorption and emission. RoHS compliant.
MAX MCR A/B Electronic Grade Epoxy Potting Compound, 48 Fluid Ounce Kit, Electronic Grade, Sealing, Waterproofing, Insulating, Circuit Masking
PRODUCT DESCRIPTION
MAX MCR BLACK A/B is medium working time, low viscosity potting compound resin system for embedding and encapsulating printed circuit boards (PCB), relays, coils, and other electronic components and circuitry.
MAX MCR A/B is low viscosity and is room temperature cured. It is mixed 2:1 by weight or by volume and provides a 30 minute working time (200-gram mass). The mixed consistency is similar to that of mineral oil, and it is poured in place, injected, or adaptable for mix meter dispensing equipment.
MAX MCR A/B is non-electrically conductive upon cure. It creates a permanent barrier that prevents direct physical contact with the circuitry. It cures to a hard and tough compound that is suitable for potting small to medium parts up to 6 ounces (180 grams) in mass without excessive exothermic heat generation.
MAX MCR A/B bonds to PVC, PP, ABS, Plastisol, aluminum, steel, copper, brass and other materials typically used in electrical assembly and printed circuit boards. Upon cure, MAX MCR A/B is hard and waterproof suitable for continuous water immersion and exposure to harsh environments. Its opaque black color permanently masks proprietary circuit design and identification of the electronic components.
PHYSICAL PROPERTIES ROPERTIES
Mix Ratio: 2:1 by Weight Or Volume
Mixed Viscosity: 1,950 cPs @75°F
Density: 1.10 G/CC
Working Time: 30 Minutes
Cure Time: 24 Hours @75°F
Accelerated Cure: 2 Hours @ 200°F
Hardness: 78 Shore D
Volume Resistivity: 4.7 X 1013 Ohms-Cm
Dielectric Strength: 510 Volts/Mil 60 Cycles
Dielectric Constant: 4.0 (10 kHz)
Dissipation Factor: 0.014 (10 kHz)
Thermal Conductivity: 0.25 W F/mK
Kit Sizes
196 Fl.Oz: https://www.amazon.com/dp/B01J1FTVBS
96 Fl.Oz: https://www.amazon.com/dp/B01J1G1V7Y
Mix & Cast Demo
https://youtu.be/WqSE3MKm7Wg
Epoxyseal 9000 Electronic Grade Potting Epoxy Resin
MAX MCR Electronic Grade Epoxy Resin -1.5 Gallon Kit Electrically Non-Conductive Potting Compound, Circuit Board Encapsulating, Embedding, Masking & Waterproofing, Opaque Black, Medium Set, Thin
10pcs, Small Potting Box Open Plastic Enclosure 45mm x 30mm x 15mm, Electronics Project Protection Dish, to use with Potting Epoxy Compound, P0S12001800S2
You are buying a 5 pack
MAX MCR Electronic Grade Epoxy Resin System – 3/4 Gallon Kit for Electrical Insulation, Electronic Potting, Encapsulating, Waterproffing, Masking Sealant, Circuit Board, Induction Coil
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